| 主权项 |
1. A positive resist composition for immersion exposure, comprising the following (A) to (D):
(A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3), in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D): wherein each of R1 to R7 independently represents an alkyl group, a cycloalkyl group or an aryl group; and R1 and R2, R3 and R4, and R6 and R7 may combine with each other to form a ring, respectively, the resin (C) contains at least one group selected from the group consisting of the following (x) to (z): (x) an alkali-soluble group, (y) a group capable of decomposing by the action of an alkali developer to increase the solubility in an alkali developer, and (z) a group capable of decomposing by the action of an acid, polydispersity of the resin (C) is from 1 to 2, the compound (B) is a compound represented by the following formula (ZI): wherein R202 and R203 independently represents an organic group, Z− is an aliphatic sulfonate anion substituted by a fluorine atom at the α-position of the sulfonic acid, and the resin (A) contains at least one repeating unit represented by formula (1): wherein R1 represents a hydrogen atom, a methyl group or a group represented by —CH2—R9, and R9 represents a monovalent organic group, R2 represents an alkyl group or a cycloalkyl group, and each R independently represents an atomic group necessary for forming an alicyclic structure together with the carbon atom; wherein the resin (C) is an organic polymer. |
