发明名称 Mold for thermal nanoimprint lithography, process for fabricating the same, and nanoimprint process using the same
摘要 A heating mold for thermal nanoimprint lithography is disclosed. According to one aspect, the mold includes a resistive heating element and collecting element for collecting the electromagnetic energy of a variable electromagnetic field emitted by a source located outside the mold. The collecting element being connected to the resistive heating element in which the electromagnetic energy is dissipated. A method for manufacturing the mold, a thermal nanoimprint lithography device including the mold, and a a method for preparing a substrate including a surface nanostructured by a thermal nanoimprint lithography technique using the mold is applied are also disclosed.
申请公布号 US8974215(B2) 申请公布日期 2015.03.10
申请号 US201113227388 申请日期 2011.09.07
申请人 Commissariat a l'Energie Atomique et aux Energies Alternatives 发明人 Landis Stefan;Nicoletti Sergio
分类号 A01J21/00;G03F7/00;B82Y10/00;B82Y40/00 主分类号 A01J21/00
代理机构 Knobbe Martens Olson & Bear LLP 代理人 Knobbe Martens Olson & Bear LLP
主权项 1. A heating mold for thermal nanoimprint lithography comprising: a substrate including a first main surface and a second main surface, and a first membrane lying through a first of its sides on said second main surface and at least partially covering said second main surface, the first membrane being an electrically and thermally insulating membrane; a resistive heating element on the other one of the sides of said second membrane in an area of said first membrane; an electrically and thermally insulating layer which covers said resistive heating element and at least partially covers said first membrane; at least one pattern printed on said electrically and thermally insulating layer in an area of the surface of said electrically and thermally insulating layer above said heating element; and a collecting element configured to collect electromagnetic energy of a variable electromagnetic field emitted by a source located outside the mold, said collecting element being connected to said resistive heating element through which said electromagnetic energy is dissipated.
地址 Paris FR