发明名称 |
Mold for thermal nanoimprint lithography, process for fabricating the same, and nanoimprint process using the same |
摘要 |
A heating mold for thermal nanoimprint lithography is disclosed. According to one aspect, the mold includes a resistive heating element and collecting element for collecting the electromagnetic energy of a variable electromagnetic field emitted by a source located outside the mold. The collecting element being connected to the resistive heating element in which the electromagnetic energy is dissipated. A method for manufacturing the mold, a thermal nanoimprint lithography device including the mold, and a a method for preparing a substrate including a surface nanostructured by a thermal nanoimprint lithography technique using the mold is applied are also disclosed. |
申请公布号 |
US8974215(B2) |
申请公布日期 |
2015.03.10 |
申请号 |
US201113227388 |
申请日期 |
2011.09.07 |
申请人 |
Commissariat a l'Energie Atomique et aux Energies Alternatives |
发明人 |
Landis Stefan;Nicoletti Sergio |
分类号 |
A01J21/00;G03F7/00;B82Y10/00;B82Y40/00 |
主分类号 |
A01J21/00 |
代理机构 |
Knobbe Martens Olson & Bear LLP |
代理人 |
Knobbe Martens Olson & Bear LLP |
主权项 |
1. A heating mold for thermal nanoimprint lithography comprising:
a substrate including a first main surface and a second main surface, and a first membrane lying through a first of its sides on said second main surface and at least partially covering said second main surface, the first membrane being an electrically and thermally insulating membrane; a resistive heating element on the other one of the sides of said second membrane in an area of said first membrane; an electrically and thermally insulating layer which covers said resistive heating element and at least partially covers said first membrane; at least one pattern printed on said electrically and thermally insulating layer in an area of the surface of said electrically and thermally insulating layer above said heating element; and a collecting element configured to collect electromagnetic energy of a variable electromagnetic field emitted by a source located outside the mold, said collecting element being connected to said resistive heating element through which said electromagnetic energy is dissipated. |
地址 |
Paris FR |