Ball arrangement for integrated circuit package devices

摘要

An integrated circuit package includes a ball arrangement that includes transmitter contact pairs arranged in a first portion of a ball grid array disposed in the integrated circuit package. Each of the transmitter contact pairs include transmitter differential signal contacts. Pairs of the transmitter contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes receiver contact pairs arranged in a second portion of the ball grid array. Each of the receiver contact pairs include receiver differential signal contacts. Pairs of the receiver contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes voltage supply contacts arranged at least between every two pairs of the transmitter contact pairs and the receiver contact pairs.

主权项

1. An integrated circuit package, comprising:
a ball arrangement comprising:
a plurality of transmitter contact pairs arranged in a first portion of a ball grid array disposed in the integrated circuit package, each of the plurality of transmitter contact pairs comprising transmitter differential signal contacts, wherein pairs of the plurality of transmitter contact pairs located adjacent to one another are in a staggered arrangement;a plurality of receiver contact pairs arranged in a second portion of the ball grid array, each of the plurality of receiver contact pairs comprising receiver differential signal contacts, wherein pairs of the plurality of receiver contact pairs located adjacent to one another are in a staggered arrangement; andvoltage supply contacts arranged between every two pairs of the plurality of transmitter contact pairs and between every two pairs of the plurality of receiver contact pairs.