发明名称 Pattern shape evaluation method and pattern shape evaluation apparatus
摘要 An image of the joint portion of circuit patterns manufactured using a design pattern for double patterning is read out. Target boundary lines and evaluation regions are set on the image. In the evaluation regions, image processing is performed along the directions of the target boundary lines. Furthermore, binarization processing is performed. A decision is made based on an image obtained in this way as to whether the patterns have defects.
申请公布号 US8977034(B2) 申请公布日期 2015.03.10
申请号 US201013381629 申请日期 2010.06.29
申请人 Hitachi High-Technologies Corporation 发明人 Toyoda Yasutaka;Matsuoka Ryoichi
分类号 G06K9/00;G01B15/04;H01L21/66 主分类号 G06K9/00
代理机构 Miles & Stockbridge P.C. 代理人 Miles & Stockbridge P.C.
主权项 1. A pattern shape evaluation method of evaluating a circuit pattern using a data storage device which stores data, an arithmetic unit which processes data, an input device permitting a user to perform input processing, and a display device which displays image data, said pattern shape evaluation method comprising: reading out a design pattern used for double patterning and including at least two design patterns from said data storage device; reading out an image of a joint portion of circuit patterns fabricated using said design pattern for double patterning from said data storage device; setting a target boundary line specified along a direction of an edge of a joint portion of two circuit patterns which are jointed in design data as a target position in which said joint portion of said two circuit patterns should be disposed in said image of the joint portion of circuit patterns; setting an evaluation region specified for image processing to be performed in a next image processing step; performing image processing along a direction of said target boundary line in the evaluation region set on the image of the circuit patterns; performing binarization processing in said evaluation region after performing said image processing; and making a decision as to whether or not the circuit patterns have defects based on an image obtained after performing said binarization processing, wherein during said image processing, a moving average value of pixel values is computed along said target boundary line in said evaluation region and along a direction within ±45 degrees with respect to the direction of the target boundary line.
地址 Tokyo JP
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