SEMICONDUCTOR STRUCTURE INCLUDING CONDUCTIVE FILM

摘要

In an embodiment of the present invention, a semiconductor structure includes a semiconductor substrate which has a pad exposed to the outside; a protection layer which covers the semiconductor substrate and has an opening part to expose the pad to the outside; a PCB substrate which has an outer lead; and a conductive film which is interposed between the semiconductor substrate and the PCB substrate to electrically connect the pad and the outer lead.