| 发明名称 |
Lead frame package structure with low electromagnetic interference |
| 摘要 |
A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal. |
| 申请公布号 |
US8975539(B2) |
申请公布日期 |
2015.03.10 |
| 申请号 |
US201213414732 |
申请日期 |
2012.03.08 |
| 申请人 |
NOVATEK Microelectronics Corp. |
发明人 |
Pai Yu-Chang |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
| 主权项 |
1. A lead frame package structure with low EMI, comprising:
at least one die holder, for supporting a die; and at least one lead frame, each including a first terminal for connecting a printed circuit board, a second terminal for connecting to the die through a gold wire, and a lead for connecting the first terminal and the second terminal; wherein, the lead has a length from the first terminal to the gold wire; wherein, within the length, a height of the lead is lower than a height of the first terminal and a height of the gold wire, such that a ground plane of the printed circuit board is utilized as a reference ground of the lead frame to reduce EMI; wherein the first terminal is a Gull-Wing pin. |
| 地址 |
Hsinchu Science Park, Hsin-Chu TW |
