| 发明名称 | Device and method for treating wafer-shaped articles | ||
| 摘要 | A method and device for processing wafer-shaped articles comprises a closed process chamber. A rotary chuck is located within the process chamber, and is adapted to hold a wafer shaped article thereon. An interior fluid distribution ring is positioned above the rotary chuck, and comprises an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof. At least one fluid distribution nozzle extends into the closed process chamber and is positioned so as to discharge fluid onto the annular surface of the fluid distribution ring. | ||
| 申请公布号 | US8974632(B2) | 申请公布日期 | 2015.03.10 |
| 申请号 | US201113307421 | 申请日期 | 2011.11.30 |
| 申请人 | Lam Research AG | 发明人 | Tschinderle Ulrich;Gleissner Andreas;Brugger Michael |
| 分类号 | C23C16/00;C23F1/12;B05D5/12;B08B3/08;H01L21/67 | 主分类号 | C23C16/00 |
| 代理机构 | Young & Thompson | 代理人 | Young & Thompson |
| 主权项 | 1. Device for processing wafer-shaped articles, comprising a process chamber, a rotary chuck located within said process chamber, said rotary chuck being adapted to hold a wafer shaped article thereon, an interior fluid distribution ring positioned above said rotary chuck, said fluid distribution ring comprising an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof, and at least one fluid distribution nozzle extending into said process chamber and being positioned so as to discharge fluid onto said annular surface of said fluid distribution ring. | ||
| 地址 | Villach AT | ||