发明名称 Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof
摘要 There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
申请公布号 US8976074(B2) 申请公布日期 2015.03.10
申请号 US201113103297 申请日期 2011.05.09
申请人 Samsung Electro-Mechanics Co., Ltd. 发明人 Sung Jae Suk;Hong Ha Ryong;Chang Ki Won;Mun Hyun Sam;Lee Dae Kyo;Lee Byung Hwa;Kim Tae Sung;Lim Dae Ki;Na Yong Shik;Lee Duk Woo
分类号 H01Q1/40;H01Q1/24 主分类号 H01Q1/40
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. An electronic device case having a low frequency antenna pattern embedded therein, the case comprising: a radiator frame injection molded using a polymer mixture containing a magnetic substance component such that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
地址 Suwon-si, Gyeonggi-do KR