Gold die bond sheet preform

摘要

The amount of gold required for bonding a semiconductor die to an electronic package is reduced by using a sheet preform tack welded to the package prior to mounting the die. The preform, only slightly larger than a semiconductor die to be attached to the package, is placed in the die bond location and tack welded to the package at two spaced locations.

主权项

1. A method of forming a semiconductor bond site on a semiconductor package comprising the steps of:
forming a gold containing die bond sheet preform having a width, a length and a substantially uniform thickness; placing the die bond sheet preform on a die bond area on a semiconductor package; and welding the die bond sheet preform to the package die bond area at two spaced apart spots, the two spaced apart spots having a total area significantly smaller than the area of the sheet preform.