| 发明名称 | Redistribution board, electronic component and module | ||
| 摘要 | A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer. | ||
| 申请公布号 | US8975735(B2) | 申请公布日期 | 2015.03.10 |
| 申请号 | US201313962622 | 申请日期 | 2013.08.08 |
| 申请人 | Infineon Technologies AG | 发明人 | Otremba Ralf;Höglauer Josef |
| 分类号 | H01L23/02;H01L23/34;H01L23/06;H01L21/00;H05K7/00;H01L23/522;H01L29/778 | 主分类号 | H01L23/02 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A redistribution board, comprising: a first conductive layer comprising a redistribution structure for low voltage signals; a second conductive layer comprising a redistribution structure for high voltage signals; a non-conductive layer, the second conductive layer being spaced apart from the first conductive layer by the non-conductive layer; and a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer, the conductive connector being surrounded by a low voltage trace of the first conductive layer. | ||
| 地址 | Neubiberg DE | ||