发明名称 |
Anti-fuse device |
摘要 |
An electrically programmable gate oxide anti-fuse device includes an anti-fuse aperture having anti-fuse links that include metallic and/or semiconductor electrodes with a dielectric layer in between. The dielectric layer may be an interlayer dielectric (ILD), an intermetal dielectric (IMD) or an etch stop layer. The anti-fuse device may includes a semiconductor substrate having a conductive gate (e.g., a high K metal gate) disposed on a surface of the substrate, and a dielectric layer disposed on the conductive gate. A stacked contact can be disposed on the dielectric layer and a gate contact is disposed on an exposed portion of the gate. |
申请公布号 |
US8975724(B2) |
申请公布日期 |
2015.03.10 |
申请号 |
US201213613008 |
申请日期 |
2012.09.13 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Park Yong;Wang Zhongze;Zhu John J.;Yeap Choh fei |
分类号 |
H01L23/525;G11C17/16;H01L27/06;H01L27/10;H01L27/112 |
主分类号 |
H01L23/525 |
代理机构 |
|
代理人 |
Talpalatsky Sam;Pauley Nicholas J.;Agusta Joseph |
主权项 |
1. A gate oxide anti-fuse device comprising:
a semiconductor substrate having an active region; a gate disposed on an active surface of the active region of the semiconductor substrate; a dielectric layer disposed on the gate; a stacked contact disposed on a surface of the dielectric layer opposite the gate, the dielectric layer disposed between the stacked contact and the gate; and a gate contact disposed on the gate. |
地址 |
San Diego CA US |