发明名称 Lateral MOS power transistor having backside terminal electrode
摘要 A semiconductor component may include a semiconductor layer which has a front side and a back side, a first terminal electrode on the front side, a second terminal electrode on the back side, a first dopant region of a first conduction type on the front side, which is electrically connected to one of the terminal electrodes, a second dopant region of a second conduction type in the semiconductor layer, which is electrically connected to the other terminal electrode, a pn junction being formed between the first and second dopant regions, a dielectric layer on the back side between the semiconductor layer and the second terminal electrode, and the dielectric layer having an opening through which an electrical connection between the second terminal electrode and the first or second dopant region is passed.
申请公布号 US8975696(B2) 申请公布日期 2015.03.10
申请号 US201113108711 申请日期 2011.05.16
申请人 Infineon Technologies AG 发明人 Haeberlen Oliver;Hirler Franz;Roesch Maximilian
分类号 H01L21/02;H01L29/66;H01L29/78;H01L29/417;H01L29/861;H01L29/06;H01L29/10;H01L29/40 主分类号 H01L21/02
代理机构 SpryIP, LLC 代理人 SpryIP, LLC
主权项 1. Lateral MOS power transistor, comprising a semiconductor layer which has a front side and an opposite back side, a source electrode on the front side of the semiconductor layer, a drain electrode on the back side of the semiconductor layer, a first dopant region of a first conduction type on the front side in the semiconductor layer, which is electrically connected to the source electrode, a second dopant region of a second conduction type in the semiconductor layer, which is electrically connected to the drain electrode, a pn junction being formed between the first and second dopant a dielectric layer on the back side of the semiconductor layer between the semiconductor layer and the drain electrode, the dielectric layer having an opening through which an electrical connection between the drain electrode and the second dopant region is passed, and a terminal zone defined in the semiconductor layer, the terminal zone positioned directly above the opening, the opening thereby providing a straight line path between the terminal zone and the drain electrode.
地址 Neubiberg DE