| 发明名称 | Light emitting diode package and method for manufacturing the same | ||
| 摘要 | An LED package includes a lens, an LED chip securely received and engaged in the lens, and a base with an electrode assembly thereon. A bottom surface of the LED chip is bare. The lens is mounted on the base and the bottom surface of the LED chip electrically and mechanically connects with the electrode assembly. | ||
| 申请公布号 | US8975651(B2) | 申请公布日期 | 2015.03.10 |
| 申请号 | US201313864260 | 申请日期 | 2013.04.17 |
| 申请人 | Hon Hai Precision Industry Co., Ltd. | 发明人 | Chou Yun-Yu;Chen Ko-Hua |
| 分类号 | H01L33/00;H01L21/00;H01L33/64;H01L33/54 | 主分类号 | H01L33/00 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A method for manufacturing an LED package comprising following steps: providing an LED chip; providing a mold and arranging the LED chip in the mold; injecting a material with high light transmittance in the mold, the material enclosing the LED chip except a bottom surface of the LED chip, wherein the material in the mold form a lens, and the LED chip is securely received and engaged in the lens; removing the lens together with the LED chip from the mold; providing a base with an electrode assembly; and mounting the lens on the base to make the bottom surface of the LED chip electrically connect with the electrode assembly simultaneously. | ||
| 地址 | New Taipei TW | ||