| 摘要 |
<p>PURPOSE: A semiconductor device unloading method in a test handler is provided to prevent a fault loading state of a semiconductor device, thereby improving reliability of an unloading process. CONSTITUTION: The lower side part of a pad placed in the lower part of a picker is inserted in a loading groove of an insert(S61). The insert is opened by operating a opening apparatus(S62). A semiconductor device loaded in the loading groove is absorbed and gripped by the pickers(S63). The semiconductor device gripped by the pickers is unloaded(S64). The insert is closed by reversely operating the opening apparatus(S65).</p> |
