| 摘要 |
In a method of manufacturing a semiconductor light emitting device, the method of manufacturing a semiconductor light emitting device includes a step of placing a semiconductor light emitting device chip which generates light by using the recombination of electrons and holes on a substrate; a step of encapsulating the semiconductor light emitting device chip with a transparent material; a step of forming a colored protection layer which opens the upper and the lower part of the semiconductor light emitting device chip and touches the transparent material; and a step of placing an optical conversion material containing layer which contains an optical conversion material which changes light generated in the semiconductor light emitting device chip into light of different wavelength on the semiconductor light emitting device chip. |
