A METHOD FOR DE-BONDING OF DEVICE WAFER AND CARRIER WAFER AND APPARATUS FOR DE-BONDING

摘要

The present invention relates to a method and an apparatus for de-bonding a device wafer and a carrier wafer. More specifically, the present invention relates to a method of de-bonding a wafer assembly formed by depositing a photothermal conversion layer and a ultra-violet (UV) layer between the device wafer and the carrier wafer and bonding the device wafer and the carrier wafer. The method includes the steps of: 1) decomposing the photothermal conversion layer by preventing a bump and a chip of the device wafer provided at a lower portion from being damaged as a laser beam, an irradiation amount of which is adjusted, is irradiated toward a transmissive carrier wafer; 2) separating the carrier wafer from one end portion of the device wafer, wherein a de-bonding unit is placed on the carrier wafer with the photothermal conversion layer decomposed so that the de-bonding unit closely makes contact with the carrier wafer in vacuum; 3) depositing a protective layer on the UV layer at a time point where the UV layer is open after the carrier wafer is separated; and 4) releasing the protective layer by using a release tape after the protective layer sticks with the UV layer by curing the protective layer.