SEMICONDUCTOR DEVICE MEMBER, LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE MEMBER, AND LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER USING THE METHOD, PHOSPHOR COMPOSITION, SEMICONDUCTOR LIGHT EMITTING DEVICE, ILLUMINATING APPARATUS AND IMAGE DISPLAY APPARATUS

摘要

To provide a semiconductor device member that is superior in heat resistance, light resistance, film-formation capability and adhesion, and is capable of sealing a semiconductor device and holding a phosphor without causing cracks, peelings and colorings even after used for a long period of time, the weight loss at the time of heating, measured by a predetermined weight-loss at-the-time-of-heating measurement method, is 50 weight % or lower and the ratio of peeling, measured by a predetermined adhesion evaluation method, is 30 % or lower, in the semiconductor device member.