| 摘要 |
<p>The present invention consists in a device for welding electronic components of superficial mounting and straight-through orifice in printed circuit boards by the application of a flame, resulting from the combustion of the hydroxy gas, which is generated by the same system through water electrolysis and the movement of said flame by a numeric control machine. The invention is characterized in that the temperature of the body (or packing) of most of the electronic components is not increased more than 70°C during the welding process of the pins over the printed circuit boards, this characteristic being desirable in components which construction includes polymers suffering deformations when are subjected to the temperatures resulting from the methods commonly used in the industry. The aforementioned characteristic is achieved by the flame for welding the components which results from the combustion of hydroxyl gas, which has a high temperature. Consequently, the time the flame is appli ed for melting the weld is reduced, so that the raise of the temperature of the body of the electronic components is lower than that resulting from most of the methods used in the industry or in a manual form.</p> |
