发明名称 EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART
摘要 <p>There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on a portion of the first base electrode formed on at least one of the first and second main surfaces of the ceramic body, the second external electrode includes a second base electrode and a second terminal electrode formed on a portion of the second base electrode formed on at least one of the first and second main surfaces of the ceramic body.</p>
申请公布号 KR101499715(B1) 申请公布日期 2015.03.06
申请号 KR20130084042 申请日期 2013.07.17
申请人 发明人
分类号 H01G4/12;H01G4/30;H05K3/46 主分类号 H01G4/12
代理机构 代理人
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