| 摘要 |
A switch module includes a switch circuit, a chip device which is a coupler, a chip device that defines together with the coupler a common-terminal-side circuit, chip devices defining switching-terminal-side circuits, and a multilayer substrate. The multilayer substrate includes inner-layer ground electrodes. A first inner-layer ground electrode is closer to the chip device than a second inner-layer ground electrode and includes an opening arranged so as not to be superposed with the chip device when viewed in plan in the stacking direction of the multilayer substrate. |
