发明名称 |
APPARATUS AND METHODS FOR RAPID THERMAL PROCESSING |
摘要 |
Embodiments of the present invention provide apparatus and methods for performing rapid thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes a heating source disposed outside a chamber body and configured to provide thermal energy towards a processing volume. The substrate support defines a substrate supporting plane, and the substrate support is configured to support the substrate in the substrate supporting plane. The heating source includes a frame member having an inner wall surrounding an area large enough to encompass a surface area of the substrate, and a plurality of diode laser tiles mounted on the inner wall of the frame member. Each of the plurality of diode laser tiles is directed towards a corresponding area in the processing volume. |
申请公布号 |
KR20150023368(A) |
申请公布日期 |
2015.03.05 |
申请号 |
KR20147034697 |
申请日期 |
2013.05.29 |
申请人 |
APPLIED MATERIALS, INC.;LAWRENCE LIVERMORE NATIONAL SECURITY, LLC |
发明人 |
RANISH JOSEPH M.;HUNTER AARON MUIR;SOULES THOMAS F.;RUBENCHIK ALEXANDER M. |
分类号 |
H05B3/00;H01L21/67 |
主分类号 |
H05B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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