发明名称 MODULE COMPONENT MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a module component manufacturing method which can favorably form a conductive paste on a lateral face of a module component by spray coating in a mass-production process.SOLUTION: A module component manufacturing method comprises: a process of forming a plurality of module components 1 on a principal surface of an aggregate substrate; a process of forming grooves 3 among the plurality of module components 1 by dicing; a process of spraying a conductive paste P toward the principal surface of the aggregate substrate; and a process of singularizing the plurality of module components 1. In the process of spraying the conductive paste P, the conductive paste P is sprayed in a manner such that a projection Ia of a spraying direction I on the principal surface is parallel with a width direction of the groove 3 and an angle formed between the spray direction and the principal surface is an angle &thetas;. When assuming that a depth of the groove 3 is D and a width of the groove 3 is w, the angle &thetas; is set so as to satisfy Formula (1): tan(D/2w)≤&thetas;≤tan(2D/w) (1).
申请公布号 JP2015043357(A) 申请公布日期 2015.03.05
申请号 JP20130174118 申请日期 2013.08.26
申请人 TDK CORP 发明人 KAWABATA KENICHI;KOMATSU MASATORA
分类号 H05K9/00;H01L21/301;H01L23/00 主分类号 H05K9/00
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