| 发明名称 |
Overmolded substrate-chip arrangement with heat sink |
| 摘要 |
An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate. |
| 申请公布号 |
US2015062825(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314011772 |
申请日期 |
2013.08.28 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Ossimitz Peter;Schaefer Juergen;Chen Liu;Dinkel Markus;MacHeiner Stefan |
| 分类号 |
H01L23/34;H05K3/32;H01L21/48 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device, comprising:
a substrate; at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system; a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device; and an overmolding structure configured for at least partially encapsulating the at least one electronic chip and the substrate. |
| 地址 |
Neubiberg DE |
