| 摘要 |
A method is provided for bonding a chip to a substrate, the method comprising the steps of providing a chip, providing a substrate, providing a recess in one of the chip and the substrate, arranging the chip and the substrate in contact with each other thereby forming a predetermined contact area and at least partly covering the recess by the other one of the chip and the substrate, and providing an amount of liquid adhesive in the recess for providing a bonding layer. |
