发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device which includes a microfabricated transistor with buried gate electrodes. In the semiconductor device, a gate electrode is formed over a substrate, extending in the direction parallel to the first side of a device formation region. The gate electrode lies across the device formation region. A plurality of buried gate electrodes are buried in the device formation region of the substrate and in a plan view, the gate electrode partially overlap them. The buried gate electrodes extend obliquely to the first side of the device formation region and are parallel to each other. In each buried gate electrode, the first end opposite to the first side and the second end opposite to the second end of the device formation region are both parallel to the first side.
申请公布号 US2015061001(A1) 申请公布日期 2015.03.05
申请号 US201414457578 申请日期 2014.08.12
申请人 RENESAS ELECTRONICS CORPORATION 发明人 IKEDA Masahiro
分类号 H01L29/423;H01L29/78;H01L27/088 主分类号 H01L29/423
代理机构 代理人
主权项 1. A semiconductor device comprising: a substrate including a rectangular device formation region having a first side, a second side opposite to the first side, a third side, and a fourth side; a device separation region being formed in the substrate and surrounding the device formation region; a plurality of buried gate electrodes being buried in the device formation region of the substrate and in a plan view, extending obliquely to the first side and being parallel to each other; and two impurity layers being formed in the device formation region of the substrate and spaced from each other in a direction parallel to the third side and opposite to each other with the buried gate electrodes therebetween, wherein in the buried gate electrodes, first ends opposite to the first side and second ends opposite to the second side are all parallel to the first side.
地址 Kawasaki-shi JP