| 摘要 |
<p>[Problem] In a method for manufacturing metal parts using electrotyping, to make it possible to peel the metal part without relief pattern defects even when the scale of the pattern is microscopic. [Solution] Metal parts such as a metal mold (10) is manufactured by: forming, on the surface of a template (20) with a microscopic relief pattern on the surface, a mold release layer (16) that follows the relief pattern; forming an electrically conductive initial layer (14) on the mold release layer (16); forming a metal layer (12) on the initial layer (14) by electrotyping a metal material; and peeling the composite plate in which the initial layer (14) and the metal layer (12) have been united from the template in an organic solvent. When so doing, the coefficient of viscosityηmPa∙s of the organic solvent at 35°C satisfies Expression 1 and Expression 2 when the height of the relief pattern is H µm and the density of the relief pattern is N pieces/µm2.η< 0.9 --- Expression 1η× H × N < 1.6 --- Expression 2</p> |
