| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape that hardly generates burrs even when dicing at a high speed in a blade dicing process.SOLUTION: The wafer processing tape includes: a base material layer; an adhesive layer; and a bonding agent layer, sequentially laminated. The base material layer is a thermoplastic resin film whose total endothermic amount accompanying melting of the thermoplastic resin film in a range of 30°C to 200°C is equal to or less than 80 J/g. |
