发明名称 SURFACE PLANARIZATION METHOD OF THIN FILM AND PREPARING METHOD OF ARRAY SUBSTRATE
摘要 A surface planarization method of thin film and a preparing method of an array substrate relate to a display field, and can solve the technical problem that the conventional dry etching severely damages the surface flatness of other film layers below the one being etched, thereby improving the display properties of the LCD. The preparing method of the array substrate comprises patterning a non-metallic layer (4) by a dry etching. And following the step of patterning a non-metallic layer (4) by the dry etching, the method further comprises performing surface planarization on a first film layer (3) to recover the first film layer (3) with a rough surface caused by the dry etching to be planar. The first film layer (3) is located below the non-metallic layer (4).
申请公布号 US2015064927(A1) 申请公布日期 2015.03.05
申请号 US201314347819 申请日期 2013.06.05
申请人 BEINING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ;BOE TECHNOLOGY GROUP CO., LTD. 发明人 Chen Lei;Xia Ziqi;Dai Wukun;Li Jiapeng;Jin Xiuhong;Wang Fengguo;Zhang Lei;Qiu Miao
分类号 H01L21/3065;H01L21/308 主分类号 H01L21/3065
代理机构 代理人
主权项 1. A surface planarization method of thin film, comprising: patterning a non-metallic layer located above a first film layer by dry etching; and planarizing the exposed first film layer after the dry etching to recover the first film layer with a rough surface caused by the dry etching to be planar.
地址 Beiing CN