| 发明名称 |
Separation of Chips on a Substrate |
| 摘要 |
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is performed and then the partially separated substrate is completely separated into a plurality of parts. |
| 申请公布号 |
US2015064879(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314013822 |
申请日期 |
2013.08.29 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Engelhardt Manfred;Stranzl Gudrun;Zundel Markus;Maier Hubert |
| 分类号 |
H01L21/78;B28D5/00;H01J37/32 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
partially dicing a substrate into a plurality of partially separate parts; and completely separating the partially separated parts from each other. |
| 地址 |
Neubiberg DE |
