THERMOELECTRIC DEVICES HAVING REDUCED THERMAL STRESS AND CONTACT RESISTANCE, AND METHODS OF FORMING AND USING THE SAME

摘要

A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.

主权项

1. A method of forming a thermoelectric device, the method including:
preparing a thermoelectric material including a p-type or n-type material and first and second caps respectively including first and second cap materials respectively disposed on either side of the p-type or n-type material, the first and second cap materials each respectively including an independently selected transition metal, wherein forming the thermoelectric material includes:
loading a powder precursor of the first cap material into a sintering die;assembling one or more punches to the powder precursor of the first cap material in the sintering die;applying a first pre-load via the one or more punches to the powder precursor of the first cap material to form a first pre-pressed structure including a first substantially flat surface;removing a first punch of the one or more punches to expose the first substantially flat surface;loading a powder precursor of the p-type or n-type material into the sintering die and onto the exposed first substantially flat surface;assembling the first punch to the powder precursor of the p-type or n-type material in the sintering die;applying a second pre-load via the one or more punches to the first pre-pressed structure and the powder precursor of the p-type or n-type material to form a second pre-pressed structure including a second substantially flat surface;removing the first punch to expose the second substantially flat surface;loading a powder precursor of the second cap material into the sintering die and onto the exposed second substantially flat surface;assembling the first punch to the powder precursor of the second cap material in the sintering die;applying a third pre-load via the one or more punches to the second pre-pressed structure and the powder precursor of the second cap to form a third pre-pressed structure; andsintering the third pre-pressed structure to form the thermoelectric material; andcoupling at least one of the first and second caps of the thermoelectric material to an electrical connector.