发明名称 U FORM-FACTOR INTELLIGENT ELECTRONIC DEVICE (IED) HARDWARE PLATFORM WITH MATCHING OF IED WIRING, FROM A NON U FORM-FACTOR IED HARDWARE PLATFORM USING ADAPTER STRUCTURE
摘要 A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.
申请公布号 US2015062832(A1) 申请公布日期 2015.03.05
申请号 US201314013064 申请日期 2013.08.29
申请人 ABB Technology AG 发明人 Ismayilov Shamsi;Khalifa Yaser A.;Koudelka Frantisek;Oksengorn Arkady;Lau Siu;Patel Hardik;Choi In Y.
分类号 H05K7/02;H05K13/00 主分类号 H05K7/02
代理机构 代理人
主权项 1. A method of providing an Intelligent Electronic Device (IED) with new hardware modules, the method comprising: providing hardware modules configured for electrically connecting with connections of a first IED housing that has a first form factor, providing a second IED housing having a second form factor that is different from the first form factor, mounting the hardware modules in the second housing, employing adaptor structure to electrically connect the hardware modules with connections of the second housing; and mounting the second housing into an existing wiring and second form factor environment.
地址 Zurich CH