| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A semiconductor device includes a conductive portion having semiconductor elements provided on a substrate, a case housing the conductive portion, and a lead terminal integrated into the case to be directly connected to the semiconductor elements or an interconnection of the substrate. The lead terminal has a stress relief shape for reliving stress generated in the lead terminal. |
| 申请公布号 |
US2015061098(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201414222402 |
申请日期 |
2014.03.21 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
IMOTO Yuji;YOSHIMATSU Naoki;FUJINO Junji |
| 分类号 |
H01L23/495;H01L21/50 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a conductive portion including a semiconductor element provided on a substrate; a case housing said conductive portion; and a lead terminal integrated into said case to be directly connected to said semiconductor element or an interconnection of said substrate, wherein said lead terminal has a stress relief shape for relieving stress generated in said lead terminal. |
| 地址 |
Tokyo JP |
