METHOD FOR MANUFACTURING COMPONENT-INTEGRATED SHEET, METHOD FOR MANUFACTURING RESIN MULTILAYER SUBSTRATE IN WHICH ELECTRONIC COMPONENT IS INCORPORATED, AND RESIN MULTILAYER SUBSTRATE

摘要

　The present invention provides: a method for manufacturing a component-integrated sheet in which degradation of characteristics can be suppressed while displacement of an electronic component is sufficiently prevented in a resin multilayer substrate in which the electronic component is incorporated, and a method for manufacturing a resin multilayer substrate in which the electronic component is incorporated. The present invention is a method for manufacturing a component-integrated sheet in which an electronic component and a thermoplastic resin sheet containing a thermoplastic resin are integrated, wherein the method for manufacturing a component-integrated sheet includes a paste application step for applying a paste containing the same thermoplastic resin as the thermoplastic resin contained in the resin sheet onto at least a part of one of the main surfaces of the electronic component or at least a part of a portion on one of the main surfaces of the resin sheet that is bonded to the electronic component, a mounting step for mounting the electronic component onto the resin sheet with the paste interposed therebetween, and a drying step for drying the paste.