| 发明名称 |
HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE |
| 摘要 |
<p>Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.</p> |
| 申请公布号 |
KR20150023540(A) |
申请公布日期 |
2015.03.05 |
| 申请号 |
KR20147036906 |
申请日期 |
2013.07.02 |
| 申请人 |
ELEMENT SIX TECHNOLOGIES US CORPORATION |
发明人 |
DIDUCK QUENTIN;FRANCIS DANIEL;LOWE FRANK YANTIS;EJECKAM FELIX |
| 分类号 |
H01L21/683;H01L21/02;H01L23/373 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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