SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, COPPER CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated copper foil capable of giving such a surface profile of a substrate after removal of the copper foil that maintains an ability to form microwiring and achieves favorable adhesion strength of an electroless copper plating film.SOLUTION: The surface-treated copper foil has a surface treatment layer formed on a copper foil, in which the surface of the surface treatment layer has a particle-equivalent area ratio of 0.1 to 0.85.