发明名称 THERMALLY EXPANDABLE PREPARATIONS
摘要 The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.
申请公布号 US2015064380(A1) 申请公布日期 2015.03.05
申请号 US201414491034 申请日期 2014.09.19
申请人 HENKEL AG & CO. KGaA 发明人 BARRIAU Emilie;Renkel Martin;Schoenfeld Rainer;Wucherpfennig Sven;Welters Tim
分类号 C08J9/00 主分类号 C08J9/00
代理机构 代理人
主权项 1. A thermally expandable preparation pumpable at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity at 25° C. of at most 1250 Pa*s, (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity at 25° C. of at most 250 Pa*s, (c) at least one thermally activatable hardener, (d) at least one thermally activatable blowing agent, and (e) at least 1 wt. % organic fibers having a fiber length from 0.2 mm to 10 mm.
地址 Duesseldorf DE