发明名称 |
Deposition System And Method Of Forming A Metalloid-Containing Material Therewith |
摘要 |
A method of forming a metalloid-containing material comprises the step of preparing a hydrometalloid compound in a low volume on-demand reactor. The method further comprises the step of feeding the hydrometalloid compound prepared in the microreactor to a deposition apparatus. Additionally, the method comprises the step of forming the metalloid-containing material from the hydrometalloid compound via the deposition apparatus. A deposition system for forming the metalloid-containing material comprises at least one low volume on-demand reactor coupled to and in fluid communication with a deposition apparatus. |
申请公布号 |
US2015064364(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201314379018 |
申请日期 |
2013.02.14 |
申请人 |
Dow Corning Corporation |
发明人 |
Nguyen Binh;Telgenhoff Michael |
分类号 |
C23C16/452;C23C16/448;H01J37/34;C23C16/50;C23C14/35;C23C16/44;C23C16/48 |
主分类号 |
C23C16/452 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a metalloid-containing material with a deposition system which comprises at least one low volume on-demand reactor indirectly coupled to and in indirect fluid communication with a deposition apparatus, said method comprising the steps of:
preparing a hydrometalloid compound in the low volume on-demand reactor; indirectly feeding the hydrometalloid compound prepared in the low volume on-demand reactor to the deposition apparatus; and forming the metalloid-containing material with the deposition apparatus. |
地址 |
Midland MI US |