SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A method of manufacturing a semiconductor structure includes several operations. The several operations include placing a plurality of dies on a carrier; defining a first zone and a second zone in a top surface of the carrier; calculating a first coverage ratio in the first zone; calculating a second coverage ratio in the second zone; disposing a dummy block on a specified location of the top surface of the carrier if the difference between the first coverage ratio and the second coverage ratio is greater than a predetermined value; forming a molding compound on the carrier.

主权项

1. A method of manufacturing a semiconductor structure, comprising:
attaching a plurality of dies to a top surface of a carrier; placing a dummy block on a specified uncovered area of the top surface; depositing a molding compound over the top surface of the carrier; wherein the block has a coefficient of thermal expansion (CTE) between a CTE of the plurality of dies and the carrier.