| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure which is applied to the case of mounting of electronics parts or via connection, and increases joint reliability after a thermal shock in a connection structure in which a first connecting object is connected to a second connecting object by using a solder.SOLUTION: A connection structure includes a region 9 where at least a Cu-Sn intermetallic compound, a M-Sn intermetallic compound (where M is Ni and/or Mn), and a Cu-M-Sn intermetallic compound exist in a cross-section of a connecting part 4 when the cross-section of the connecting part 4 is analyzed by a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part 4 is evenly segmented into ten sections in a vertical direction and in a lateral direction to form 100 cells in total, a ratio of the number of cells in which at least two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the cells excluding cells each of which has only an Sn-based metal component is 70% or more. |
