SEMICONDUCTOR DEVICE, DESIGN METHOD, AND DESIGN ASSIST PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device including a monolayer interposer capable of flexibly changing the dimension, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device includes a monolayer interposer 100 including wiring 5 formed between electrode pad groups 11 and side edges. The wiring 5 connects the electrode pad group 11 provided along the one side edge with the electrode pad ground 11 provided along the other side edge.