| 摘要 |
A method for manufacturing a ceramic circuit board, which comprises: a bonding step wherein a metal plate is bonded to a ceramic substrate with a brazing material being interposed therebetween, thereby obtaining a bonded body; and a pattern forming step wherein the bonded metal plate is subjected to etching, thereby forming a circuit pattern. This method for manufacturing a ceramic circuit board is characterized in that: the brazing material contains Ag; and this method also comprises a step wherein the substrate provided with the circuit pattern is further etched using an acidic solution that contains a carboxylic acid and/or a carboxylic acid salt together with hydrogen peroxide, thereby removing unnecessary brazing material. |
