| 摘要 |
<p>The present invention provides a semiconductor device having high heat transferability and excellent machinability, and a production method therefor. The present invention is provided with the following: an insulating substrate (13); a semiconductor chip (11) provided on the insulating substrate; and a cooling member (12) bonded to the rear surface of the insulating substrate via a bonding material (23). The insulating substrate has an insulating plate (6), and a conductive plate (5) and a conductive plate (7) provided on both surfaces of the insulating plate. The cooling member is a composite member in which a thermal stress absorbing member (1) made of aluminum and a heat transferring metal member (2) are integrally formed. The thermal stress absorbing member is provided on the side of the cooling member that bonds with the insulating substrate rear surface, and the yield stress of the thermal stress absorbing member is lower than that of the bonding material.</p> |
