发明名称 |
Sacrificial Layers for Bio-Compatible Devices |
摘要 |
A method may involve: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device. |
申请公布号 |
US2015065820(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201314011478 |
申请日期 |
2013.08.27 |
申请人 |
Google Inc. |
发明人 |
Ho Harvey;Etzkorn James;Yao Huanfen |
分类号 |
A61B5/145 |
主分类号 |
A61B5/145 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer, wherein the first bio-compatible layer defines a first side of a bio-compatible device; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern, wherein the second bio-compatible layer defines a second side of the bio-compatible device; and removing the sacrificial layer to release the bio-compatible device from the working substrate. |
地址 |
Mountain View CA US |