发明名称 Sacrificial Layers for Bio-Compatible Devices
摘要 A method may involve: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.
申请公布号 US2015065820(A1) 申请公布日期 2015.03.05
申请号 US201314011478 申请日期 2013.08.27
申请人 Google Inc. 发明人 Ho Harvey;Etzkorn James;Yao Huanfen
分类号 A61B5/145 主分类号 A61B5/145
代理机构 代理人
主权项 1. A method comprising: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer, wherein the first bio-compatible layer defines a first side of a bio-compatible device; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern, wherein the second bio-compatible layer defines a second side of the bio-compatible device; and removing the sacrificial layer to release the bio-compatible device from the working substrate.
地址 Mountain View CA US