| 发明名称 |
THERMAL MODULE |
| 摘要 |
A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers. |
| 申请公布号 |
US2015060020(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314016219 |
申请日期 |
2013.09.02 |
| 申请人 |
ASIA VITAL COMPONENTS CO., LTD. |
发明人 |
Yang Hsiu-Wei |
| 分类号 |
F28D15/04 |
主分类号 |
F28D15/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermal module comprising a housing having multiple independent compartments not in communication with each other, each compartment communicating with an open end of at least one heat pipe, the open end communicating with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers. |
| 地址 |
New Taipei City TW |
