发明名称 HEAT PUMP APPARATUS
摘要 A heat pump apparatus (100) includes an evaporator (10), an electrochemical compressor (11), a condenser (16), a refrigerant delivery path (18), and a non-condensable gas return path (28). The non-condensable gas return path (28) is provided separately from the refrigerant delivery path (18), and is configured to communicate a discharge-side high-pressure space of the electrochemical compressor (11) with a suction-side low-pressure space of the electrochemical compressor (11) so as to return a non-condensable gas from the high-pressure space to the low-pressure space. The non-condensable gas is, for example, hydrogen gas.
申请公布号 US2015059383(A1) 申请公布日期 2015.03.05
申请号 US201414385342 申请日期 2014.01.23
申请人 Panasonic Corporation 发明人 Sakamoto Naoki;Haraki Yu
分类号 F25B30/02;F25B41/06 主分类号 F25B30/02
代理机构 代理人
主权项 1. A heat pump apparatus comprising: an evaporator that evaporates a refrigerant; an electrochemical compressor that compresses the refrigerant evaporated in the evaporator by use of an electrochemically active, non-condensable gas; a condenser that condenses the refrigerant compressed by the electrochemical compressor; a refrigerant delivery path for delivering the refrigerant from the condenser to the evaporator; and a non-condensable gas return path provided separately from the refrigerant delivery path, the non-condensable gas return path being configured to communicate a discharge-side high-pressure space of the electrochemical compressor with a suction-side low-pressure space of the electrochemical compressor so as to return the non-condensable gas from the high-pressure space to the low-pressure space.
地址 Kadoma-shi, Osaka JP