| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component in which adhesive strength between a conductive resin layer and a plating layer is large.SOLUTION: A multilayer ceramic capacitor 10 as a multilayer ceramic electronic component includes a ceramic element body 12. The ceramic element body 12 has internal electrodes 16a, 16b buried therein. External electrodes 20a, 20b which are electrically connected to exposed portions 18a, 18b of the internal electrodes 16a, 16b are formed on end surfaces 12e, 12f sides of the ceramic element body 12. The external electrodes 20a, 20b include sinter metal layers 22a, 22b, conductive resin layers 24a, 24b, and plating layers 26a, 26b. A border includes a protrusion having a depth of 1.0μm to 7.0μm from the plating layer toward the conductive resin layer side.</p> |
