| 发明名称 |
JOINING A CHIP TO A SUBSTRATE WITH TWO OR MORE DIFFERENT SOLDER ALLOYS |
| 摘要 |
A method including forming a first solder bump on a chip, the first solder bump made of a first alloy, and forming a second solder bump on a chip, the second solder bump made of a second alloy, where the first alloy has a different alloy concentration and is different from the second alloy. |
| 申请公布号 |
US2015061158(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314013182 |
申请日期 |
2013.08.29 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Pharand Sylvain |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
forming a first solder bump on a chip, the first solder bump made of a first alloy; and forming a second solder bump on a chip, the second solder bump made of a second alloy, wherein the first alloy has a different alloy concentration and is different from the second alloy. |
| 地址 |
Armonk NY US |
