CIRCUIT SUBSTRATE, SEMICONDUTOR PACKAGE STRUCTURE AND PROCESS FOR FABRICATING A CIRCUIT SUBSTRATE

摘要

A circuit substrate includes a circuit stack, a patterned conductive layer, a dielectric layer, and a plurality of thickening conductive layers. The circuit stack has a surface. The patterned conductive layer is located on the surface of the circuit stack and has a plurality of traces. Each of the traces has a bonding segment. The dielectric layer is located on the surface of the circuit stack and covers the patterned conductive layer. Besides, the dielectric layer has a plurality of bonding openings Each of the bonding openings exposes the corresponding bonding segment. Each of the thickening conductive layers is located on the corresponding bonding segment. A semiconductor package structure having the above circuit substrate and a process for fabricating a circuit substrate are also provided.

主权项

1. A circuit substrate comprising:
a circuit stack having a surface; a patterned conductive layer located on the surface of the circuit stack, the patterned conductive layer having a plurality of traces, each of the traces having a bonding segment; a dielectric layer located on the surface of the circuit stack, the dielectric layer covering the patterned conductive layer and having a plurality of bonding openings, each of the bonding openings exposing a corresponding bonding segment of the bonding segments; and a plurality of thickening conductive layers, each of the thickening conductive layers being located on a corresponding bonding segment of the bonding segments.