发明名称 |
INSULATION SHEET MADE FROM SILICON NITRIDE, AND SEMICONDUCTOR MODULE STRUCTURE USING THE SAME |
摘要 |
An insulation sheet made from silicon nitride comprising: a sheet-shaped silicon-nitride substrate which contains β-silicon-nitride crystal grains as a main phase; and a surface layer which is formed on one face or both front and back faces of surfaces of the silicon-nitride substrate and is formed from a resin or a metal which includes at least one element selected from among In, Sn, Al, Ag, Au, Cu, Ni, Pb, Pd, Sr, Ce, Fe, Nb, Ta, V and Ti. A semiconductor module structure using the insulation sheet made from silicon nitride. |
申请公布号 |
US2015061107(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201414534808 |
申请日期 |
2014.11.06 |
申请人 |
KABUSHIKI KAISHA TOSHIBA ;TOSHIBA MATERIALS CO., LTD. |
发明人 |
NABA Takayuki |
分类号 |
H01L23/15;H01L23/373;H01L23/13 |
主分类号 |
H01L23/15 |
代理机构 |
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代理人 |
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主权项 |
1. An insulation sheet, comprising:
a sheet-shaped silicon-nitride substrate comprising β-silicon-nitride crystal grains as a main phase; and a surface layer formed on one face or both front and back faces of Surfaces of the silicon-nitride substrate from at least one metal element selected from the group consisting of In, Sn, Al, Ag, Au, Cu, Ni, Pb, Pd, Sr, Ce, Fe, Nb, Ta, V and Ti; wherein: the surface layer has a Vickers hardness of 200 or less and a thickness of 100 μm or less, the silicon-nitride substrate has a surface roughness Ra of 0.2 to 1.5 μm, and the insulation sheet is suitable for a pressure contact structure in which the insulation sheet is pressed to another member through the surface layer. |
地址 |
Tokyo JP |