Method for Forming Three Dimensional Circuit

摘要

A method for a forming three dimensional circuit is provided. A plastic base is provided. A metal layer is bonded on the plastic base by a metal coating process. The thickness of the metal layer is thickened by an electroplating process. The metal layer is trimmed to form a circuit pattern thereon by a laser engraving process, whereby, the working-hours can be reduced and the cost of material can also be reduced when the three dimensional circuit is manufactured.

主权项

1. A method for forming a three dimensional circuit, comprising:
providing a plastic base; bonding a metal layer on a surface of said plastic base by a metal coating process to form a coating film on said plastic base; electroplating said metal layer to thicken the thickness of said metal layer; and trimming said metal layer to form a circuit pattern thereon by a laser engraving process.